multilayer ceramic chip capacitors 1 of 3 creation date : may 29, 2017 (gmt) c3216x7r1v106k160ac tdk item description c3216x7r1v106kt**** applications commercial grade feature general general (up to 50v) series c3216 [eia 1206] status production size length(l) 3.20mm 0.20mm width(w) 1.60mm 0.20mm thickness(t) 1.60mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 1.00mm min. recommended land pattern (pa) 2.10mm to 2.50mm(flow soldering) 2.00mm to 2.40mm(re?ow soldering) recommended land pattern (pb) 1.10mm to 1.30mm(flow soldering) 1.00mm to 1.20mm(re?ow soldering) recommended land pattern (pc) 1.00mm to 1.30mm(flow soldering) 1.10mm to 1.60mm(re?ow soldering) electrical characteristics capacitance 10f 10% rated voltage 35vdc temperature characteristic x7r(15%) dissipation factor (max.) 7.5% insulation resistance (min.) 50m other soldering method wave (flow) re?ow aec-q200 no packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : may 29, 2017 (gmt) c3216x7r1v106k160ac characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c3216x7r1v106k160ac esr c3216x7r1v106k160ac capacitance c3216x7r1v106k160ac dc bias characteristic c3216x7r1v106k160ac temperature characteristic c3216x7r1v106k160ac(no bias) c3216x7r1v106k160ac(dc bias = 17.5v ) ripple temperature rising c3216x7r1v106k160ac(100khz) c3216x7r1v106k160ac(500khz) c3216x7r1v106k160ac(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : may 29, 2017 (gmt) c3216x7r1v106k160ac associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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